TY  - DATA
AU  - Köhler,J.Michael
ED  - ebrary, Inc
TI  - Etching in microsystem technology
SN  - 3527295615
AV  - TK7872.M3 
U1  - 621.3815/31 
PY  - 1999///
CY  - Weinheim ;New York
PB  - Wiley-VCH
KW  - Microlithography
KW  - Plasma etching
KW  - Masks (Electronics)
N1  - Includes bibliographical references ([345]-360) and index; Etching in Microsystem Technology; Preface; Contents; Table of Contents; Symbols; Abbreviations; 1 Introduction; 2 Distinctive Features of Microtechnical Etching; 3 Wet-Chemical Etching Methods; 4 Dry-Etching Methods; 5 Microforming by Etching of Locally Changed Material; 6 Chosen Recipes; References; Index; Online-Ausg; Palo Alto, Calif; ebrary; 2009; Electronic reproduction; Available via World Wide Web
N2  - Microcomponents and microdevices are increasingly finding application in everyday life. The specific functions of all modern microdevices depend strongly on the selection and combination of the materials used in their construction, i.e., the chemical and physical solid-state properties of these materials, and their treatment. The precise patterning of various materials, which is normally performed by lithographic etching processes, is a prerequisite for the fabrication of microdevices. The microtechnical etching of functional patterns is a multidisciplinary area, the basis for the etching proc
UR  - https://onlinelibrary-wiley-com.libraryproxy.ist.ac.at/doi/book/10.1002/9783527613786
ER  -